Semiconductor
VIA wafer depth measurement
Date：2020-06-04
Source：Samsun Technology
VIA wafer depth measurement using white light spectral interferometric sensors
Wafer depth measurement 3D profile
Depth measurement 2D topography
Depth = 112.3 +/-0.4 μm
Depth = 65.28 +/- 0.1 μm
Depth = 87.28 +/- 0.6 μm
